BXSTS100C - Intel Thermal Solution Active/Passive Combo Heat up to 130-Watts CPU TDP Socket LGA1366

Ensure optimal thermal performance for your Intel LGA1366 processors with the Intel Thermal Solution BXSTS100C. This versatile active/passive combo heatsink is engineered to manage CPU thermal design power (TDP) up to 130-Watts, offering a reliable and efficient cooling solution for demanding applications. Available at a competitive price, it's designed to maintain system stability and longevity.

Key Features

• Brand: Intel
• Model: BXSTS100C
• Type: Active/Passive Combo Heat Sink
• CPU TDP Support: Up to 130-Watts
• Socket Compatibility: LGA1366
• Cooling Method: Active fan with passive heatsink design
• Intended Use: CPU cooling for compatible Intel platforms
• Form Factor: Standard heatsink and fan assembly

Ideal for IT professionals, system builders, and businesses requiring dependable cooling for Intel LGA1366 based systems. Whether you're upgrading an existing server or building a new workstation, the Intel BXSTS100C provides the performance you need. Trust sasconnects.com for competitive UK pricing, reliable stock, and efficient dispatch on all your essential IT hardware. Add this essential cooling component to your basket today.